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| Type | 描述 |
|---|---|
| 系列: | 658 |
| 包裹: | - |
| 零件状态: | Obsolete |
| 类型: | Top Mount |
| 包冷却: | BGA |
| 附着方式: | Thermal Tape, Adhesive (Included) |
| 形状: | Square, Pin Fins |
| 长度: | 1.100" (27.94mm) |
| 宽度: | 1.100" (27.94mm) |
| 直径: | - |
| 翅片高度: | 0.598" (15.20mm) |
| 功耗@温升: | 2.5W @ 30°C |
| 热阻@强制气流: | 2.00°C/W @ 500 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
| 图片 | 零件号 | 描述 | Stock / Unit Price |
|---|---|---|---|
 |
HS06Apex Microtechnology |
HEATSINK 12P DIP .6C/W |
有存货: 0 $0.00000 |
 |
825802B05300Comair Rotron |
HEATSINK STAMP 24.1X48.3X49.5MM |
有存货: 0 $0.00000 |
 |
811102B00000Comair Rotron |
HEATSINK STAMP 22.2X5.4X30.3MM |
有存货: 0 $0.00000 |
 |
TG-CJ-30.5-30.5-6-PFt-Global Technology |
HEATSINK CER 30.5X30.5X6MM |
有存货: 0 $0.00000 |
 |
TG-CJ-12-12-10-PFt-Global Technology |
HEATSINK CER 12X12X10MM |
有存货: 0 $0.00000 |
 |
658-60ABT4Wakefield-Vette |
HEATSINK CPU 27.9MM SQ W/ADH BLK |
有存货: 0 $0.00000 |
 |
APF19-19-13CBCTS Corporation |
HEATSINK LOW-PROFILE FORGED |
有存货: 0 $0.00000 |
 |
VHS-95CUI Devices |
HEATSINK HALF BRICK ALUM BLACK |
有存货: 0 $0.00000 |
 |
647-10ABPWakefield-Vette |
HEATSINK TO-220 W/PINS BLK 1" |
有存货: 0 $0.00000 |
 |
831502B03700Comair Rotron |
HEATSINK STAMP 19X12.8X12.7MM |
有存货: 0 $0.00000 |
