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TS391SNL250

TS391SNL250

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制造商部分
TS391SNL250
制造商
Chip Quik, Inc.
描述
THERMALLY STABLE SOLDER PASTE NO
类别
焊接、拆焊、返修产品
家庭
焊接
系列
-
有存货
13
在线数据表
-
询问

Product Specifications

Type 描述
系列:-
包裹:Bulk
零件状态:Active
类型:Solder Paste
作品:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
直径:-
熔点:423 ~ 428°F (217 ~ 220°C)
助焊剂类型:No-Clean
线规:-
过程:Lead Free
形式:Jar, 8.8 oz (250g)
保质期:12 Months
保质期开始:Date of Manufacture
储存/冷藏温度:68°F ~ 77°F (20°C ~ 25°C)

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