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TC1-20G

TC1-20G

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制造商部分
TC1-20G
制造商
Chip Quik, Inc.
描述
HEAT SINK COMPOUND - HIGH DENSIT
类别
风扇,热管理
家庭
热粘合剂、环氧树脂、油脂、糊剂
系列
-
有存货
165
在线数据表
-
询问

Product Specifications

Type 描述
系列:-
包裹:Bulk
零件状态:Active
类型:Silicone Compound
尺寸/尺寸:20 gram Syringe
使用温度范围:-
颜色:White
导热系数:0.67W/m-K
特征:-
保质期:60 Months
储存/冷藏温度:37°F ~ 77°F (3°C ~ 25°C)

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