Type | 描述 |
---|---|
系列: | THERMFLOW® T777 |
包裹: | Strip |
零件状态: | Active |
用法: | - |
类型: | Gap Filler Pad, Sheet |
形状: | Square |
大纲: | 28.00mm x 28.00mm |
厚度: | 0.0045" (0.115mm) |
材料: | Polymer Solder Hybrid |
粘合剂: | Tacky - Both Sides |
后盾,载体: | - |
颜色: | Gray |
热电阻率: | - |
导热系数: | - |
图片 | 零件号 | 描述 | Stock / Unit Price |
---|---|---|---|
![]() |
GCS-040-3.0 |
THERMAL PAD, 4W/M K, 3.0MM |
有存货: 0 $23.70000 |
![]() |
CD-02-05-C-20Wakefield-Vette |
THERM PAD 0.768" X 0.768" |
有存货: 430 $0.43000 |
![]() |
35MM-35MM-25-5590H-053M |
THERM PAD 35MMX35MM GRAY 1=25/PK |
有存货: 58 $28.66000 |
![]() |
A17653-11Laird - Performance Materials |
THERM PAD 228.6MMX228.6MM PINK |
有存货: 2 $163.51000 |
![]() |
SF600-202005CUI Devices |
THERMAL INTERFACE MATERIAL, SF60 |
有存货: 0 $38.57750 |
![]() |
A17174-03Laird - Performance Materials |
TFLEX P330 18.00X18.00IN, |
有存货: 10 $128.41000 |
![]() |
BS89-160-160-2.5 |
THERMAL PAD, SHEET 160X160MM, TH |
有存货: 24 $95.28000 |
![]() |
5583S 210 MM X 300 MM X 2.0 MM3M |
THERM PAD 300MMX210MM WHITE |
有存货: 0 $40.09000 |
![]() |
SF500G-414505CUI Devices |
THERMAL INTERFACE MATERIAL, SF50 |
有存货: 0 $36.36000 |
![]() |
25.4MM-12.7MM-25-88103M |
THERM PAD 25.4MMX12.7MM 1=25/PK |
有存货: 0 $20.92000 |